QC-20 BGA-IC Glue Remover

Feature:

• 20ml BGA IC glue epoxy remover QC20.

• Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.

• Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.

• It won’t do harm to your circuit board and components. Environment friendly and safe.

• Doesn’t contain any Benzene Coderivative substances with cause leukaemia. Convenient to use