PRODUCT DETAILS
MECHANIC iBGA Max Middle Automatic positioning Tin Planting Platform Fixture For IPHONE Mobile Phone IPX XSMAX IP11 11PRO MAX
1.Brand : MECHANIC.
2.Item NO : iBGA Max.
3.Size : 97*76*20mm.
4.LEAK-PROOF TIN DESIGN.
5.Support IPX/XS/XS MAX/11/11PRO/11PRO MAX.
6.Model : Automatic positioning tin-planting platform for the mid-level motherboard.
7.To prevent the tin paste dropped on other parts, Effectively protect the motherborad of mobile phones.
8.Automatic positioning, No offset, Accurate and fast, So that the maintenance work efficiency is higher.
Package : 1 * BGA Reballing Platform
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